Series: Wspc Series In Advanced Integration and Packaging

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cover image of Cooling of Microelectronic and Nanoelectronic Equipment

Cooling of Microelectronic...

Wspc Series In Advanced Integration and Packaging (Series)

Madhusudan Iyengar Editor
Karl J L Geisler Editor
(2014)

cover image of Design and Modeling For 3d Ics and Interposers

Design and Modeling For 3d...

Wspc Series In Advanced Integration and Packaging (Series)

Madhavan Swaminathan Author
Ki Jin Han Author
(2013)

cover image of Mems Packaging

Mems Packaging

Wspc Series In Advanced Integration and Packaging (Series)

Yung-cheng Lee Editor
Yu-ting Cheng Editor
(2018)

cover image of Solder Materials

Solder Materials

Wspc Series In Advanced Integration and Packaging (Series)

Kwang-lung Lin Author
(2018)

cover image of Cost Analysis of Electronic Systems ()

Cost Analysis of Electronic...

Wspc Series In Advanced Integration and Packaging (Series)

Peter Sandborn Author
(2016)

cover image of Cost Analysis of Electronic Systems

Cost Analysis of Electronic...

Wspc Series In Advanced Integration and Packaging (Series)

Peter Sandborn Author
(2012)

cover image of Thermoelectric Energy Conversion Devices and Systems

Thermoelectric Energy...

Wspc Series In Advanced Integration and Packaging (Series)

Kazuaki Yazawa Author
Je-hyeong Bahk Author
(2021)

cover image of Embedded Cooling of Electronic Devices

Embedded Cooling of...

Wspc Series In Advanced Integration and Packaging (Series)

Madhusudan Iyengar Editor
Justin A Weibel Editor
(2024)