3D IC and RF SiPs

ebook ∣ Advanced Stacking and Planar Solutions for 5G Mobility · IEEE Press

By Lih-Tyng Hwang

cover image of 3D IC and RF SiPs

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Format

ebook

ISBN

9781119289647

Series

IEEE Press

Author

Lih-Tyng Hwang

Publisher

Wiley

Release

29 March 2018

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Subjects

Technology Nonfiction

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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

  • Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
  • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
  • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
  • Provides chapter-wise review questions and powerpoint slides as teaching tools

    • Format

    ebook

    ISBN

    9781119289647

    Series

    IEEE Press

    Author

    Lih-Tyng Hwang

    Publisher

    Wiley

    Release

    29 March 2018

    Share

    Subjects

    Technology Nonfiction
    3D IC and RF SiPs