The 39th International Microelectronics and Packaging Society (IMAPS) Poland International Conference was held in Gdansk between 20 and 23 September 2015. This event was organized by the Gdansk University of Technology. The scope of the Conference covered 'everything in electronics between the chip and the system'. The conference was attended by 99 participants, including 21 guests from abroad. During the Conference, 18 invited lectures and 78 posters were presented. The conference was supported by five international journals indexed in the Journal Citation Report database.In this special issue e-book of Soldering and Surface Mount Technology, six papers have been selected from the conference, covering the processes and procedures associated with soldering and assembly technology. The editors hope that it will be of interest to readers of the journal and that it will help them to find novel solutions, contribute to the creation of new ideas and initiate many varied discussions about new developments in this very important area of electronics assembly.