Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks

This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.

Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.