Micro-miniaturization in electronics—a necessity for personal communications devices like cell phones and PDAs—has radically altered the materials these electronics are made from.

This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design.

* ALL NEW—A complete rewrite of the previous edition
* Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices
* Full materials breakdown for high density packaging techniques
* Materials for communications wiring and cabling