Introduction to Microelectronics Advanced Packaging Assurance

ebook Synthesis Lectures on Engineering, Science, and Technology

By Navid Asadizanjani

cover image of Introduction to Microelectronics Advanced Packaging Assurance

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This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Introduction to Microelectronics Advanced Packaging Assurance