The Industry Standard Guide to Wire Bonding—Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

Ultrasonic bonding systems and technologies, including high-frequency systems

Bonding wire metallurgy and characteristics, including copper wire

Wire bond testing

Gold-aluminum intermetallic compounds and other interface reactions

Gold and nickel-based bond pad plating materials and problems

Cleaning to improve bondability and reliability

Mechanical problems in wire bonding

High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds

Copper, low-dielectric-constant (Cu/Lo-k) technology and problems

Wire bonding process modeling and simulation

CD includes all the book's full-color figures plus animations