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cover image of Advanced MEMS Packaging

Advanced MEMS Packaging

John H. Lau Author
Cheng Kuo Lee Author
(2009)

cover image of Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant...

John H. Lau Author
(2010)

cover image of Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D...

John H. Lau Author
(2012)